Systems and methods for producing non-standard shaped cards

ABSTRACT

Example embodiments of systems and methods for card production are provided. A card may include processing circuitry including a chip and memory. The card may include one or more antennas in communication with the chip. The card may include a first layer of material aligned within a perimeter of the card via laminate encapsulation. The first layer of material may comprise a non-rectangular shape. The first layer of material may be offset with a shape of the card. The first layer of material may be in communication with the chip. The first layer of material may comprise at least one selected from the group of steel, tungsten, titanium, or any combination thereof. The card may be compliant with one or more form factors.

CROSS-REFERENCE TO RELATED APPLICATION

The subject application is a continuation of U.S. patent applicationSer. No. 16/733,964, filed Jan. 3, 2020, the complete disclosure ofwhich is incorporated herein by reference in its entirety.

FIELD OF THE INVENTION

The present disclosure relates to the production of cards, and moreparticularly, to systems and methods for producing non-standard shapedcards.

BACKGROUND

Many cards, such as credit cards and debit cards, are producing using aCR80 (rectangular) form factor. Accordingly, many or all high throughputmachines for putting user information on the cards are set up to runrectangular shapes. When working with other shapes, these machines mustbe custom build or modified, which can increase costs and delayproduction while reducing the incentive to develop new and varied carddesigns.

These and other deficiencies exist. Accordingly, there is a need toprovide users with an appropriate solution that overcomes thesedeficiencies and promotes the development of new card designs whilereducing development and production costs.

SUMMARY

Aspects of the disclosed technology include systems and methods forout-of-band authenticity verification of mobile applications.

Embodiments of the present disclosure provide a card, comprising:processing circuitry including a chip and memory. The card may includeone or more antennas in communication with the chip. The card mayinclude a first layer of material aligned within a perimeter of the cardvia laminate encapsulation. The first layer of material may comprise anon-rectangular shape. The first layer of material may be offset with ashape of the card. The first layer of material may be in communicationwith the chip. The first layer of material may comprise at least oneselected from the group of steel, tungsten, titanium or any combinationthereof. The card may be compliant with one or more form factors.

Embodiments of the present disclosure provide a method for producing acard, comprising: producing one or more cards, the one or more cardscomprising a non-rectangular shape; personalizing the one or more cards;and customizing a shape of a slug for laminate encapsulation after thepersonalization of the one or more cards, wherein the shape comprises anon-rectangular shape, and wherein the shape is arranged such that theslug is disposed within a boundary of the one or more cards.

Further features of the disclosed design, and the advantages offeredthereby, are explained in greater detail hereinafter with reference tospecific example embodiments illustrated in the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a diagram of a card according to an example embodiment.

FIG. 1B is a diagram of a card according to an example embodiment.

FIG. 2 is a diagram of a layer of material according to an exampleembodiment.

FIG. 3 is a diagram of a card according to another example embodiment.

FIG. 4 is a method illustrating a sequence for producing a cardaccording to an example embodiment.

FIG. 5 is a diagram of a card subject to body punching according to anexample embodiment.

DETAILED DESCRIPTION OF EXAMPLE EMBODIMENTS

The following description of embodiments provides non-limitingrepresentative examples referencing numerals to particularly describefeatures and teachings of different aspects of the invention. Theembodiments described should be recognized as capable of implementationseparately, or in combination, with other embodiments from thedescription of the embodiments. A person of ordinary skill in the artreviewing the description of embodiments should be able to learn andunderstand the different described aspects of the invention. Thedescription of embodiments should facilitate understanding of theinvention to such an extent that other implementations, not specificallycovered but within the knowledge of a person of skill in the art havingread the description of embodiments, would be understood to beconsistent with an application of the invention.

As further described herein, systems and methods may utilizenon-rectangular slugs while maintaining a form factor through the end ofpersonalization so that they may be punched into shape at the very endand thus do not require modification to existing machinery.

FIG. 1A illustrates a card according to an example embodiment. Asfurther discussed below, card 100 may include contact pad 105, one ormore antennas 125, and a first layer of material 130. Although FIG. 1Aillustrates single instances of the components, card 100 may include anynumber of components.

As illustrated in FIG. 1B, the card 100 may also include a contact pad105, which may include processing circuitry 110 for storing andprocessing information, including a chip or processor 115 and a memory120. The contact pad 105 may be configured to establish contact withanother communication device, such as a user device, smart phone,laptop, desktop, or tablet computer. The card 100 may also includeprocessing circuitry, antenna and other components not shown in FIG. 1A.These components may be located behind the contact pad 105. The card 100may also include one or more magnetic strips or tapes, which may belocated on one or more surfaces of the card 100. In some examples, theone or more magnetic strips or tapes may be located on the front of thecard 100 and in other examples, the one or more magnetic strips or tapesmay be located on the back of the card 100.

It is understood that the processing circuitry 110 may containadditional components, including processors, memories, error andparity/CRC checkers, data encoders, anticollision algorithms,controllers, command decoders, security primitives and tamperproofinghardware, as necessary to perform the functions described herein.

The memory 120 may be a read-only memory, write-once read-multiplememory or read/write memory, e.g., RAM, ROM, and EEPROM, and the card100 may include one or more of these memories. A read-only memory may befactory programmable as read-only or one-time programmable. One-timeprogrammability provides the opportunity to write once then read manytimes. A write once/read-multiple memory may be programmed at a point intime after the memory chip has left the factory. Once the memory isprogrammed, it may not be rewritten, but it may be read many times. Aread/write memory may be programmed and re-programed many times afterleaving the factory. It may also be read many times.

The processor and memory elements of the foregoing exemplary embodimentsare described with reference to the contact pad, but the presentdisclosure is not limited thereto. It is understood that these elementsmay be implemented outside of the contact pad 105 or entirely separatefrom it, or as further elements in addition to processor 115 and memory120 elements located within the contact pad 105.

In some examples, the card 100 may comprise one or more antennas 125.The one or more antennas 125 may be placed within the card 100 andaround the processing circuitry 110 of the contact pad 105. For example,the one or more antennas 125 may be integral with the processingcircuitry 110 and the one or more antennas 125 may be used with anexternal booster coil. As another example, the one or more antennas 125may be external to the contact pad 105 and the processing circuitry 110.

In an embodiment, the coil of card 100 may act as the secondary of anair core transformer. The terminal may communicate with the card 100 bycutting power or amplitude modulation. The card 100 may infer the datatransmitted from the terminal using the gaps in the card's powerconnection, which may be functionally maintained through one or morecapacitors. The card 100 may communicate back by switching a load on thecard's coil or load modulation. Load modulation may be detected in theterminal's coil through interference.

As explained above, the card 100 may be built on a software platformoperable on smart cards or other devices having limited memory, such asJavaCard, and one or more or more applications or applets may besecurely executed.

Referring back to FIG. 1A, the card 100 may comprise a contactless card.By way of non-limiting examples, the card 100 may comprise at least oneselected from the group of credit card, debit card, gift card,identification card, government card, and transportation card. The card100 may be in compliance with one or more form factors, including butnot limited to CR80 and CR100. It is understood that the card 100 is notlimited to a contactless card, and that contact-based or other cards areincluded within the present disclosure. It is further understood thatthe present disclosure is not limited to a certain type of card, such asa payment card or an identification card, and the present disclosureincludes any type of card.

The first layer of material 130 may comprise a slug. For example, thefirst layer of material 130 may be aligned within a perimeter of thecard 100. In some examples, the first layer of material 130 may comprisea predetermined shape. In some examples, the predetermined shape maycomprise one or more apertures configured to house contact pad 105. Thepredetermined shape may comprise any shape, including a non-rectangularshape.

The non-rectangular shape of the first layer of material 130 maycomprise one or more portions, such as edges, sides, and/or corners. Forexample, any one of the one or more portions may be curved. By way ofnon-limiting examples, the non-rectangular shape may comprise a circularshape, an oval shape, an elliptical shape, a trapezoidal shape, ahorseshoe shape, a bullet shape, a door knob shape, or any other shape.The first layer of material 130 may comprise at least one selected fromthe group of steel, tungsten, titanium, and/or any combination thereof.

The first layer of material 130 may be disposed within the card vialaminate encapsulation after personalization of the card 100. In someexamples, personalization of the card 100 may include encoding data,card embossing, and printing data onto a card that is specific to anaccount or user. Without limitation, personalization may furtherencompass the addition of one or more images, and/or one or morepatterns, which may be based on user preference. Personalization mayprovide the benefit of distinguishing the card 100 from other cards andthe benefit of providing additional security. In some examples, the oneor more images may comprise at least one selected from the group of apicture of the user, a picture chosen by the user, a logo, and asecurity image. In some examples, the one or more patterns may includeat least one selected from the group of a pattern chosen by the user, acomputer generated pattern, and a randomly generated pattern. The firstlayer of material 130 may be offset with a shape of the card 100. Forexample, the first layer of material 130 may not be used all the way tothe edge of the card 100, and thus may fall within a perimeter of thecard 100. The first layer of material 130 may be in communication withthe chip 115 to facilitate contact transactions and/or contactlesstransactions.

The first layer of material 130 may comprise a weight of about 16.3grams. In some examples, a weight of the first layer of material 130 mayexceed a weight of the plastic material contents of the card 100. Insome examples, the weight of the plastic material contents of the card100 may be less than three grams. By way of example, the first layer ofmaterial 130 may comprise a length dimension of at least three inches,and a height dimension of at least 1.5 inches.

FIG. 2 is a diagram of a layer of material 200 of a card according to anexample embodiment. In some examples, the layer of material 200 may bethe same or similar as layer of material 130 of FIG. 1A.

The first layer of material 200 may comprise a slug. For example, thefirst layer of material 200 may be aligned within a perimeter of a card,similar to that of card 100. In some examples, the first layer ofmaterial 200 may comprise a predetermined shape. In some examples, thepredetermined shape may comprise one or more apertures 205 configured tohouse a contact pad, similar to contact pad 105. The predetermined shapemay comprise any shape, including a non-rectangular shape.

The non-rectangular shape of the first layer of material 200 maycomprise one or more portions, such as edges, sides, and/or corners. Forexample, any one of the one or more portions may be curved. By way ofnon-limiting examples, the non-rectangular shape may comprise a circularshape, an oval shape, an elliptical shape, a trapezoidal shape, ahorseshoe shape, a bullet shape, a door knob shape, or any other shape.The first layer of material 200 may comprise at least one selected fromthe group of steel, tungsten, tungsten, titanium, and/or any combinationthereof.

The first layer of material 200 may be disposed within the card vialaminate encapsulation after personalization of the card. In someexamples, personalization of the card may include encoding data, cardembossing, and printing data onto a card that is specific to an accountor user. Without limitation, personalization may further encompass theaddition of one or more images, one or more patterns, which may be basedon user preference. Personalization may provide the benefit ofdistinguishing the card 100 from other cards and the benefit ofproviding additional security. In some examples, the one or more imagesmay comprise at least one selected from the group of a picture of theuser, a picture chosen by the user, a logo, and a security image. Insome examples, the one or more patterns may include at least oneselected from the group of a pattern chosen by the user, a computergenerated pattern, and a randomly generated pattern. The first layer ofmaterial 200 may be in communication with a chip, similar to that ofchip 115, to facilitate contact transactions and/or contactlesstransactions.

The first layer of material 200 may comprise a weight of about 16.3grams. In some examples, a weight of the first layer of material 200 mayexceed a weight of the plastic material contents of the card. By way ofexample, the first layer of material 200 may comprise a length dimension210 of at least three inches, and a height dimension 215 of at least 1.5inches.

FIG. 3 is a diagram of a card 300 according to another exampleembodiment. The card 300 may include a layer of material 305. In someexamples, the layer of material 305 may be the same or similar as layerof material 130 of FIG. 1A and 200 of FIG. 2 .

The first layer of material 305 may comprise a slug. For example, thefirst layer of material 305 may be aligned within a perimeter of a card300, similar to that of card 100. In some examples, the first layer ofmaterial 305 may comprise a predetermined shape. In some examples, thepredetermined shape may comprise one or more apertures 310. In someexamples, aperture 310 may be configured to house contact pad orplacement of chip 315. The predetermined shape may comprise any shape,including a non-rectangular shape.

The non-rectangular shape of the first layer of material 305 maycomprise one or more portions, such as edges, sides, and/or corners. Forexample, any one of the one or more portions may be curved. By way ofnon-limiting examples, the non-rectangular shape may comprise a circularshape, an oval shape, an elliptical shape, a trapezoidal shape, ahorseshoe shape, a bullet shape, a door knob shape, or any other shape.The first layer of material 305 may comprise at least one selected fromthe group of steel, tungsten, titanium, and any combination thereof.

The first layer of material 305 may be disposed within the card 300 vialaminate encapsulation after personalization of the card 300. In someexamples, personalization of the card 300 may include encoding data,card embossing, and printing data onto a card that is specific to anaccount or user. Without limitation, personalization may furtherencompass the addition of one or more images, one or more patterns,which may be based on user preference. Personalization may provide thebenefit of distinguishing the card 100 from other cards and the benefitof providing additional security. In some examples, the one or moreimages may comprise at least one selected from the group of a picture ofthe user, a picture chosen by the user, a logo, and a security image. Insome examples, the one or more patterns may include at least oneselected from the group of a pattern chosen by the user, a computergenerated pattern, and a randomly generated pattern. The first layer ofmaterial 305 may be offset with a shape of the card 300. For example,the first layer of material 305 may not be used all the way to the edgeof the card 300, and thus may fall within a perimeter of the card 300.The first layer of material 305 may be in communication with a chip 315disposed in aperture 310, similar to that of chip 115, to facilitatecontact transactions and/or contactless transactions.

The first layer of material 305 may comprise a weight of about 16.3grams. In some examples, a weight of the first layer of material 305 mayexceed a weight of the plastic material contents of the card 300. Insome examples, the weight of the plastic material contents of the card300 may be less than three grams.

FIG. 4 illustrates a method 400 for producing a card according to anexample embodiment. The card may reference same or similar components ascard 100 of FIG. 1A, FIG. 1B, FIG. 2 , and FIG. 3 as described above.

At block 410, the method may include a first body punching step. Thefirst body punching may include yield a partially finished card to begina selected shape. As explained above, the selected shape may comprise anon-standard shape or the predetermined shape. In some examples, thefirst body punching may return a card that includes a plurality ofdimensions exceeding that of CR80. For example, the plurality ofdimensions may comprise a width dimension and a length dimension. Thus,the card may include a width and a length that are both greater thanthat of CR80, thereby distinguishing from CR80. In addition, the cardmay be comprise the same thickness to that of CR80. In some examples,the first body punching may be performed after a first set of processes.For example, the first set of processes may include but not be limitedto plate making and sheet printing, sheet collation, lamination, sheetstriping, hot stamping, and chip module milling and implanting, and anycombination thereof. It is understood that the first body punching mayoccur after any one or combination of the first set of processes.

At block 420, the method may include a chip and coding step. Forexample, coding may be used on a magnetic strip of the card. In someexamples, a defined compressed code area may be used, such that a codingwithin a defined area of the card associated with the shape is used. Thechip and magnetic strip coding may be performed after the first bodypunching and prior the second body punching.

At block 430, the method may include a second body punching step. Thesecond body punching step may yield a smaller size card than that ofCR80, and also include the same thickness of CR80. The second bodypunching may be paired with one or more punching modules and match theselected shape. The selected shape may comprise a non-standard shape orthe predetermined shape, as previously described above. In someexamples, the non-standard shape or the predetermined shape may beprogrammed as part of a card selection process when a user applies forthe card. Moreover, the card may include an antenna configured for thenon-standard shape or the predetermined shape of the second bodypunching step. In some examples, the second body punching may beperformed prior to a pairing process in which the card may be brought tothe one or more punching modules for the finished shape personalization.In some examples, the second body punching may be performed after asecond set of processes. In some examples, the second set of processesmay include one or more of the first body punching, chip and magneticstrip coding, and marking by laser engraving. It is understood that thesecond body punching may occur after any one or combination of thesecond set of processes.

FIG. 5 is a diagram 500 of a card subject to body punching according toan example embodiment. FIG. 5 may reference same or similar componentsas card 100 of FIG. 1A, FIG. 1B, FIG. 2 , FIG. 3 , and FIG. 4 , asdescribed above.

Card 505 may include a chip 515. In some examples, card 505 may be sameor similar to card 100. Chip 515 may be same or similar to chip 115.Card 505 may be subject to application of a first body punching step.The first body punching may include yield a partially finished card tobegin a selected shape. As explained above, the selected shape maycomprise a non-standard shape or the predetermined shape. In someexamples, the first body punching may return a card that includes aplurality of dimensions exceeding that of a form factor 510, such asCR80. For example, the plurality of dimensions may comprise a widthdimension and a length dimension. Thus, the card may include a width anda length that are both greater than that of CR80, thereby distinguishingfrom CR80. In addition, the card 505 may be comprise the same thicknessto that of CR80. In some examples, the first body punching may beperformed after a first set of processes. For example, the first set ofprocesses may include but not be limited to plate making and sheetprinting, sheet collation, lamination, sheet striping, hot stamping, andchip module milling and implanting, and any combination thereof. It isunderstood that the first body punching may occur after any one orcombination of the first set of processes.

In some examples, coding may be used on a magnetic strip of the card505. In some examples, a defined compressed code area may be used, suchthat a coding within a defined area of the card 505 associated with theshape is used. The chip and magnetic strip coding may be performed afterthe first body punching and prior a second body punching.

The second body punching step may yield a smaller size card, such ascard 520 or card 535, than that of form factor 510, and also include thesame thickness of form factor 510. The second body punching may bepaired with one or more punching modules and match the selected shape.The selected shape may comprise a non-standard shape or thepredetermined shape 530, 540, as previously described above. In someexamples, the non-standard shape or the predetermined shape 530, 540 maybe programmed as part of a card selection process when a user appliesfor the card 505. In one example, card 520 may include shape 530 whichmay comprise a non-rectangular shape, such as horseshoe shape or abullet shape or the like, similar to slug 130. In another example, card535 may include shape 540 which may comprise another non-rectangularshape of slug, similar to slug 130. In either example, shape 530, 540may comprise one or more rounded corners and/or one or more non-roundedcorners, or any combination thereof. In addition, it is understood thatany other shapes may be used.

Moreover, the card 505 may include an antenna 525 configured for thenon-standard shape or the predetermined shape 530, 540 of the secondbody punching step. In some examples, the second body punching may beperformed prior to a pairing process in which the card 505 may bebrought to the one or more punching modules for the finished shapepersonalization. In some examples, the second body punching may beperformed after a second set of processes. In some examples, the secondset of processes may include one or more of the first body punching,chip and magnetic strip coding, and marking by laser engraving. It isunderstood that the second body punching may occur after any one orcombination of the second set of processes.

The present disclosure includes one or more shaped cards, including butnot limited to square, elliptical, non-rectangular, rectangular,triangular, or any other shaped cards. In some examples, the card maycomprise a contactless card or a contact-based card. By way ofnon-limiting examples, the card may be at least one selected from thegroup of credit card, debit card, gift card, identification card,government card, loyalty program card, and transportation card. In someexamples, the card may be compliant with one or more form factors,including but not limited to CR80 and CR100, however, it is understoodthat non-compliant cards are within the scope of the present disclosure.

Throughout the specification and the claims, the following terms take atleast the meanings explicitly associated herein, unless the contextclearly dictates otherwise. The term “or” is intended to mean aninclusive “or.” Further, the terms “a,” “an,” and “the” are intended tomean one or more unless specified otherwise or clear from the context tobe directed to a singular form.

In this description, numerous specific details have been set forth. Itis to be understood, however, that implementations of the disclosedtechnology may be practiced without these specific details. In otherinstances, well-known methods, structures and techniques have not beenshown in detail in order not to obscure an understanding of thisdescription. References to “some examples,” “other examples,” “oneexample,” “an example,” “various examples,” “one embodiment,” “anembodiment,” “some embodiments,” “example embodiment,” “variousembodiments,” “one implementation,” “an implementation,” “exampleimplementation,” “various implementations,” “some implementations,”etc., indicate that the implementation(s) of the disclosed technology sodescribed may include a particular feature, structure, orcharacteristic, but not every implementation necessarily includes theparticular feature, structure, or characteristic. Further, repeated useof the phrases “in one example,” “in one embodiment,” or “in oneimplementation” does not necessarily refer to the same example,embodiment, or implementation, although it may.

As used herein, unless otherwise specified the use of the ordinaladjectives “first,” “second,” “third,” etc., to describe a commonobject, merely indicate that different instances of like objects arebeing referred to, and are not intended to imply that the objects sodescribed must be in a given sequence, either temporally, spatially, inranking, or in any other manner.

While certain implementations of the disclosed technology have beendescribed in connection with what is presently considered to be the mostpractical and various implementations, it is to be understood that thedisclosed technology is not to be limited to the disclosedimplementations, but on the contrary, is intended to cover variousmodifications and equivalent arrangements included within the scope ofthe appended claims. Although specific terms are employed herein, theyare used in a generic and descriptive sense only and not for purposes oflimitation.

This written description uses examples to disclose certainimplementations of the disclosed technology, including the best mode,and also to enable any person skilled in the art to practice certainimplementations of the disclosed technology, including making and usingany devices or systems and performing any incorporated methods. Thepatentable scope of certain implementations of the disclosed technologyis defined in the claims, and may include other examples that occur tothose skilled in the art. Such other examples are intended to be withinthe scope of the claims if they have structural elements that do notdiffer from the literal language of the claims, or if they includeequivalent structural elements with insubstantial differences from theliteral language of the claims.

What is claimed is:
 1. A card, comprising: a first shape, wherein: thefirst shape comprises a first layer of material, and the first shapecomprises a non-rectangular shape; a second shape comprising a perimeterof the card; and a chip, wherein the first shape is offset from thesecond shape.
 2. The card of claim 1, wherein the first shape isdisposed within the card via laminate encapsulation.
 3. The card ofclaim 2, wherein the first shape is disposed within the card vialaminate encapsulation after personalization of the card.
 4. The card ofclaim 1, wherein the card is compliant with one or more form factors. 5.The card of claim 4, wherein the one or more form factors comprise atleast one selected from the group of CR80 and CR100.
 6. The card ofclaim 1, wherein the first shape comprises one or more apertures.
 7. Thecard of claim 6, wherein the one or more apertures are configured tohouse a contact pad.
 8. The card of claim 6, wherein the chip isdisposed in one of the one or more apertures.
 9. The card of claim 1,wherein the card is at least one selected from the group of a creditcard, a debit card, a gift card, an identification card, and atransportation card.
 10. The card of claim 1, wherein the first layer ofmaterial comprises at least one selected from the group of steel,tungsten, and titanium.
 11. The card of claim 1, wherein thenon-rectangular shape comprises at least one selected from the group ofa curved edge and a curved corner.
 12. The card of claim 1, wherein thenon-rectangular shape comprises a circular shape, an oval shape, anelliptical shape, a trapezoidal shape, a horseshoe shape, a bulletshape, or a door knob shape.
 13. The card of claim 1, wherein: the cardfurther comprises an antenna in communication with the chip, and theantenna is configured for the first shape.
 14. A method, comprising:providing a card having a first shape, wherein the first shape comprisesa non-rectangular shape; personalizing the card; providing a slug havinga second shape, wherein the second shape comprises a non-rectangularshape; and performing a laminate encapsulation of the slug to the card,wherein the slug is disposed within a perimeter of the card, and whereinthe slug is offset with the first shape.
 15. The method of claim 14,wherein the second shape comprises one or more rounded corners.
 16. Themethod of claim 14, wherein: the first shape comprises a circular shape,an oval shape, an elliptical shape, a trapezoidal shape, a horseshoeshape, a bullet shape, or a door knob shape, and the second shapecomprises a circular shape, an oval shape, an elliptical shape, atrapezoidal shape, a horseshoe shape, a bullet shape, or a door knobshape.
 17. The method of claim 16, wherein the first shape and thesecond shape comprise different shapes.
 18. A card, comprising: a firstshape, wherein: the first shape comprises a first layer of material, thefirst shape comprises a non-rectangular shape, and the first shapeincludes an aperture; a second shape comprising a perimeter of the card;a chip housed within the aperture; and an antenna in communication withthe chip, wherein the antenna is configured for the first shape, andwherein the first shape is offset from the second shape.
 19. The card ofclaim 18, wherein the non-rectangular shape comprises a circular shape,an oval shape, an elliptical shape, a trapezoidal shape, a horseshoeshape, a bullet shape, or a door knob shape.
 20. The card of claim 19,wherein the first shape is personalized with at least one selected fromthe group of a picture of a user, a picture chosen by the user, asecurity image, and a pattern chosen by the user.